BKP1005TS121-T8 [TAIYO YUDEN]
Ferrite Chip,;
| 型号： | BKP1005TS121-T8 |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ferrite Chip, |
| 文件： | 总45页 (文件大小：3507K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product Information in this Catalog
■
(4) Power generation control equipment (nuclear power,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Product information in this catalog is as of October 2019. All of the
contents specified herein and production status of the products listed
in this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the
latest information carefully before practical application or use of our
products.
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
Approval of Product Specifications
■
Please contact TAIYO YUDEN for further details of product
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
4. Limitation of Liability
■
■
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for general-
purpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
Safety Design
■
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
Intellectual Property Rights
■
■
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) Highly public information network equipment, data-
processing equipment (telephone exchange, and base
station, etc.)
TAIYO YUDEN’s Official Sales Channel
■
■
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’s official sales channel.
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Caution for Export
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
20
for High Quality Equipment
Industrial Application Guide
The products described as“For Telecommunications Infrastructure and Industrial Equipment”in this
catalog are intended for use in the equipment shown in the below table as its typical example. Therefore,
when using our products for these equipment, please check it carefully by referring to the part number
or the individual product specification sheets and use the corresponding products. Should you have any
questions on this matter, please contact us.
Category
Telecommunications Infrastructure and Industrial Equipment (Typical Example)
・Base Station
Telecommunications
Infrastructure
・Optical Transceiver
・Router/Switch (Carrier-Grade)
・UPS (Uninterruptible Power Supply), etc.
・PLC (Programmable Logic Controller)
・Servomotor/Servo Driver
・Industry Robot, etc.
Factory Automation
Measurement
・Gas Meter
・Water Meter
・Flow Meter
・Pressure Gauge Meter
・Magnetometer
・Thermometer, etc.
・Power Conditioner (Solar Power System)
・Smart Meter
・GFCI (Ground Fault Circuit Interrupter)
・Electric Vehicle Charging Station, etc.
Electric Power Apparatus
■ Part Numbering System
Multilayer Ceramic Capacitors：
8
⑮
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
⑪
⑫
⑬
⑭
⑯
⑰
If the 15th code from the left is“8”, it indicates“For Telecommunications Infrastructure and Industrial
Equipment”or“For Medical Devices”.
Inductors：
8
If the 1st code from the right is“8”regardless of the total digit number, it indicates“For
Telecommunications Infrastructure and Industrial Equipment”or“For Medical Devices”.
Because there are some exceptions, for details please refer to each page of this catalog where the
part numbering system of each product is described.
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
16
for High Quality Equipment
Medical Application Guide
The products described as“For Medical Devices”in this catalog are intended for use in the medical
devices classified as GHTF Classes A to C (Japan Classes I to III) except for all medical devices classified
as GHTF Class D (Japan Class IV) and implantable medical devices (bone-anchored hearing aid, artificial
retina system, and external unit which is connected to internal unit which is implanted in a body, etc.).
Therefore, when using our products for these medical devices, please check it carefully by referring to the
part number or the individual product specification sheets and use the corresponding products. Should
you have any questions on this matter, please contact us.
Risk Level
Low
High
Class I
Class II
Class III
Specially-controlled
Medical Devices
(GHTF Class C)
Class IV
Specially-controlled
Medical Devices
(GHTF Class D)
General
Controlled
Medical Devices
(GHTF Class A)
Medical Devices
(GHTF Class B)
Medical devices with
extremely low risk to the
human body in case of
problems
Medical devices with
relatively low risk to the
human body in case of
problems
Medical devices with
relatively high risk to the
human body in case of
problems
Medical devices highly
invasive to patients and
with life-threatening risk in
case of problems
[Ex.]
[Ex.]
[Ex.]
・Dialysis Machine
[Ex.]
・In Vitro Diagnostic Devices
・Nebulizer
・Electronic Thermometer
・Cardiac Pacemaker
Japan
・Electronic Blood Pressure
・Radiation Therapy Equipment ・Video Flexible Angioscope
・Blood Gas Analyzer
・Plethysmographs
・Breathing Sensor
Gauge
・Electronic Endoscope
・Hearing Aid
・Infusion Pump
・Respirator
・Glucose Monitoring System ・Inspection Device with
・Implantable Infusion Pump
・Cardiac Electrosurgical Unit
・
AC-powered Operating Table ・Electrocardiograph
・AED (Automated External
Defibrillator)
Cardiac Catheter
・Defibrillator, etc.
・Surgical Light
・MRI
・Cholesterol Analysis Device
・Ultrasonic Diagnostic System ・Skin Laser Scanner
・Blood Type Analysis Device, ・Diagnostic Imaging Equipment ・Electric Surgical Unit
etc.
・X-ray Diagnostic Equipment ・Insulin Pump, etc.
・Central Monitor
・Pulse Oximeter, etc.
Class I
General Controls
Class II
General Controls and
Special Controls
Class III
General Controls and
Premarket Approval
Medical devices without the possibility Medical devices with the possibility Medical devices with the possibility
U.S.A.
of causing serious injury or harm
to the patient or user even if there
is a defect or malfunction in such
medical devices
of causing injury or harm to the
of causing serious injury, disability
patient or user if there is a defect or or death to the patient or user if a
malfunction in such medical devices defect or malfunction occurs in such
medical devices
Coverage of
Product Series for Medical Devices
those Classes by
TAIYO YUDEN
Products
*Note: It is prohibited that our products are used in some medical devices such as
implantable medical devices even if such medical devices are classified as GHTF
Class C (Japan Class III).
N/A
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
17
for High Quality Equipment
MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)
REFLOW
■PART NUMBER
*Operating Temp. : -55～125℃
△＝Blank space
V
B
K △
①
1
0
0
5
H
S
1
2
1
－
⑤
T
②
③
④
⑥ ⑦
①Series name
Code
④Nominal impedance
Series name
Multilayer chip bead inductor
Code
（example）
100
Nominal impedance［Ω］
BK△
10
33
②Dimensions（L×W）
Code
330
Dimensions
121
120
1000
Type（inch）
（L×W）［mm］
0.6×0.3
102
0603
1005
0603(0201)
1005（0402）
1.0×0.5
⑤Characteristics
Code
－
Characteristics
Standard
③Material
Code
HW
Material
⑥Packaging
HS
Code
T
Packaging
Taping
HR
Refer to impedance curves
for material differences
HM
⑦Internal code
LM
Code
V
Internal code
LL
MLCI for Automotive
TS
MLCI for Telecommunications infrastructure
and Industrial equipment / Medical devices
8
■FEATURES
●HW：For broadband noise suppression.
●HS：For broadband noise suppression.
●HR：For upper 10MHz noise suppression.
●HM：For upper 20MHz noise suppression.
●LM：For high frequency noise suppression around 200MHz.
●LL：For high frequency noise suppression from 100MHz.
●TS：Low DC resistance HS version.
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
e
INDL
Standard quantity [pcs]
Type
L
W
T
e
Paper tape
Embossed tape
BK 0603
（0201）
BK 1005
（0402）
0.60±0.03
（0.024±0.001）
1.00±0.05
0.30±0.03
（0.012±0.001）
0.50±0.05
030±0.03
0.15±0.05
（0.006±0.002）
0.25±0.10
15000
－
－
（0.012±0.001）
0.50±0.05
10000
（0.039±0.002）
（0.020±0.002）
（0.020±0.002）
（0.010±0.004）
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
141
for High Quality Equipment
■PART NUMBER
・ All the Multilayer Chip Bead Inductors of the catalog lineup are RoHS compliant.
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ The products are for Telecommunications infrastructure and Industrial equipment and for Medical devices.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications, etc.,
and please review and approve the product specifications before ordering.
Please be sure to contact us for further information in advance when the products are used for automotive electronic equipment.
●BK 0603
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［mA］（max.）
Thickness
［mm］
Part number
Impedance tolerance
Note
BK 0603HS220-T8
BK 0603HS330-T8
BK 0603TS800-T8
BK 0603TS121-T8
BK 0603TS241-T8
BK 0603TS601-T8
22
33
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
0.065
0.070
0.18
0.23
0.32
0.75
500
500
500
450
400
270
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
80
120
240
600
●BK 1005
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［mA］（max.）
Thickness
［mm］
Part number
Impedance tolerance
Note
BK 1005HW680-T8
BK 1005HW121-T8
BK 1005HW241-T8
BK 1005HW431-T8
BK 1005HW601-T8
BK 1005HS100-T8
BK 1005HS330-T8
BK 1005HS680-T8
BK 1005HS800-T8
BK 1005HS121-T8
BK 1005HS241-T8
BK 1005HS431-T8
BK 1005HS601-T8
BK 1005HS102-T8
BK 1005HR601-T8
BK 1005HM750-T8
BK 1005HM121-T8
BK 1005HM241-T8
BK 1005HM471-T8
BK 1005HM601-T8
BK 1005HM102-T8
BK 1005LL100-T8
BK 1005LL220-T8
BK 1005LL330-T8
BK 1005LL470-T8
BK 1005LL680-T8
BK 1005LL121-T8
BK 1005LL181-T8
BK 1005LL241-T8
BK 1005LM182-T8
68
120
240
430
600
10
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
0.17
0.24
0.31
0.50
0.60
0.03
0.06
0.10
0.10
0.20
0.30
0.45
0.55
0.58
0.60
0.18
0.18
0.30
0.45
0.50
0.70
0.11
0.18
0.25
0.33
0.31
0.45
0.50
0.70
0.90
500
450
400
350
300
1,000
700
700
700
500
400
350
300
300
300
350
300
300
250
250
150
500
400
400
350
400
350
300
250
120
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
33
68
80
120
240
430
600
1000
600
75
120
240
470
600
1000
10
22
33
47
68
120
180
240
1800
※）The rated current is the value of current at which the temperature of the element is increased within 20℃.
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
142
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■BK 0603
■BK 1005
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
143
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
144
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
●BK series
ꢀ Until 125 ℃ ambient temperature, BK series is available at 100% of the rated current.
ꢀ Please refer to the chart shown below.
BK series
120%
100%
80%
60%
40%
20%
0%
-55 -35 -15
5
25
45
65
85 105 125
Ambient Temperature(℃)
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
145
for High Quality Equipment
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES (BK SERIES P TYPE)
REFLOW
AEC-Q200
■PART NUMBER
*Operating Temp. : -55～125℃（Including self-generated heat）
△＝Blank space
V
B
K
P
1
0
0
5
H
S
1
2
1
－
⑤
T
①
②
③
④
⑥ ⑦
①Series name
Code
④Nominal impedance
Series name
Code
（example）
100
Nominal impedance［Ω］
BKP
Multilayer chip bead inductor for power line
10
33
②Dimensions（L×W）
Code
330
Dimensions
Type（inch）
121
120
220
（L×W）［mm］
221
0603
1005
0603（0201）
1005（0402）
0.6×0.3
1.0×0.5
⑤Characteristics
Code
－
Characteristics
Standard
③Material
Code
HS
Material
⑥Packaging
HM
Code
T
Packaging
Taping
Refer to impedance curves
for material differences
TS
TM
⑦Internal code
Code
V
Internal code
MLCI for Automotive
MLCI for Telecommunications infrastructure
and Industrial equipment / Medical devices
8
■FEATURES
●HS：For broadband noise suppression
●HM：For upper 20MHz noise suppression
●TS：Low DC resistance HS version.
●TM：Low DC resistance HM version.
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
e
INDL
Standard quantity [pcs]
Type
L
W
T
e
Paper tape
Embossed tape
BKP0603
（0201）
0.6±0.03
（0.024±0.001）
1.0±0.05
0.3±0.03
（0.012±0.001）
0.5±0.05
0.3±0.03
（0.012±0.001）
0.5±0.05
0.15±0.05
15000
－
－
（0.006±0.002）
0.25±0.1
BKP1005
（0402）
10000
（0.039±0.002）
（0.020±0.002）
（0.020±0.002）
（0.010±0.004）
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
146
for High Quality Equipment
■PART NUMBER
・ All the Multilayer Chip Bead Inductors of the catalog lineup are RoHS compliant.
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ The products are for Telecommunications infrastructure and Industrial equipment and for Medical devices.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications, etc.,
and please review and approve the product specifications before ordering.
Please be sure to contact us for further information in advance when the products are used for automotive electronic equipment.
●BKP0603
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Part number
Impedance tolerance
Note
BKP0603HS100-T8
BKP0603HS220-T8
BKP0603HS330-T8
BKP0603HM100-T8
10
22
33
10
±5Ω
±25％
±25％
±5Ω
100
100
100
100
30
65
70
30
1.3
1.0
1.0
1.3
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
●BKP1005
Part number
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
Note
BKP1005HS100-T8
BKP1005HS330-T8
BKP1005HS680-T8
BKP1005HS121-T8
BKP1005HS221-T8
BKP1005HM121-T8
BKP1005HM221-T8
BKP1005TS330-T8
BKP1005TS680-T8
BKP1005TS121-T8
BKP1005TM121-T8
10
33
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
100
100
30
50
2.0
1.7
1.5
1.0
0.80
1.1
0.90
1.7
1.5
1.3
1.3
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
68
75
120
220
120
220
33
140
200
120
180
39±30％
55±30％
70±30％
100
68
120
120
※）The rated current is the value of current at which the temperature of the element is increased within 40℃.
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
147
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■BKP0603
■BKP1005
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
148
for High Quality Equipment
■Derating of Rated Current
●BK series P type
ꢀ Derating of current is necessary for BK series P type depending on ambient temperature.
ꢀ Please refer to the chart shown below for appropriate derating of current.
BK series P type
120%
100%
80%
60%
40%
20%
0%
-55 -35 -15
5
25
45
65
85 105 125
Ambient Temperature(℃)
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
149
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Standard Quantity ［pcs］
Thickness
mm（inch）
Type
CK1608（0603）
CK2125（0805）
Paper Tape
Embossed Tape
－
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55（0.022）
0.6 （0.024）
0.65（0.026）
1.0 （0.039）
0.8 （0.031）
1.0 （0.039）
4000
4000
－
－
2000
－
4000
－
CKS2125（0805）
2000
－
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
4000
－
3000
3000
3000
3000
2000
－
－
－
CKP2520（1008）
－
－
LK1005（0402）
LK1608（0603）
10000
4000
4000
－
－
－
LK2125（0805）
2000
－
HK0603（0201）
HK1005（0402）
HK1608（0603）
15000
10000
4000
－
－
－
4000
3000
－
HK2125（0805）
－
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
15000
15000
15000
10000
15000
10000
15000
10000
4000
4000
－
－
－
－
BK0603（0201）
BK1005（0402）
BKH0603（0201）
BKH1005（0402）
BK1608（0603）
－
－
－
－
－
－
BK2125（0805）
2000
－
BK2010（0804）
4000
－
BK3216（1206）
4000
－
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0605（0202）
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCEE1005（0402）
MCFK1608（0603）
MCFE1608（0603）
MCKK1608（0603）
MCHK2012（0806）
MCKK2012（0805）
15000
10000
4000
4000
15000
－
－
－
－
－
10000
5000
4000
－
－
－
10000
4000
4000
－
－
3000
－
4000
-
3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
②Taping material
●Card board carrier tape
CK
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1608
2012
Top tape
CKP
CK
BK
BK
CKS
LK
BK
BK
LK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
Base tape
LK
HK
HK
HK
Sprocket hole
Chip cavity
HKQ
AQ
Bottom tape
MC
MC
Chip Filled
Chip
●Embossed Tape
Top tape
CK
2125
2125
2012
2016
2520
2125
2125
BK
2125
3216
0806
1210
2010
1608
2012
CKS
CKP
CKP
CKP
LK
BK
MCF
MCF
MCF
MC
HK
MC
Sprocket hole
Chip cavity
Base tape
Chip Filled
Chip
③Taping Dimensions
●Paper tape (8mm wide)
Unit：mm（inch）
T
1.75±0.1
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
(0.069±0.004）
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.05
F
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Chip cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Thickness
mm（inch）
Type
Ａ
Ｂ
1.0±0.2
1.8±0.2
4.0±0.1
1.1max
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HKQ0603W（0201）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
0.8 （0.031）
0.85（0.033）
0.85（0.033）
0.8 （0.031）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.3 （0.012）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.45（0.018）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.6 （0.024）
0.55（0.021）
0.65（0.026）
0.8 （0.031）
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.5±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.0±0.2
（0.091±0.008）
1.8±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.039±0.008）
0.65±0.1
（0.071±0.008）
1.15±0.1
（0.157±0.004）
2.0±0.05
（0.043max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
0.40±0.06
（0.091±0.008）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.043max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
0.40±0.06
（0.071±0.008）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.043max）
0.45max
（0.016±0.002）
0.40±0.06
（0.028±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.018max）
0.45max
（0.016±0.002）
0.40±0.06
（0.028±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.018max）
0.45max
（0.016±0.002）
0.75±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.030±0.004）
0.40±0.06
（0.045±0.004）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.031max）
0.45max
BK0603（0201）
BK1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
BKH0603（0201）
BKH1005（0402）
MCF0605（0202）
MCFK1608（0603）
MCEE1005（0402）
MCFE1608（0603）
MCHK2012（0805）
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.2±0.1
（0.091±0.008）
2.17±0.1
（0.157±0.004）
4.0±0.1
（0.043max）
0.8max
（0.047±0.004）
0.40±0.06
（0.085±0.004）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.031max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
0.40±0.06
（0.091±0.008）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.043max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
0.62±0.03
（0.045±0.004）
0.77±0.03
（0.079±0.002）
2.0±0.05
（0.031max）
0.45max
（0.024±0.001）
1.1±0.05
（0.030±0.001）
1.9±0.05
（0.079±0.002）
4.0±0.1
（0.018max）
0.72max
（0.043±0.002）
0.8±0.05
（0.075±0.002）
1.3±0.05
（0.157±0.004）
2.0±0.05
(0.028max)
0.6max
(0.031±0.002)
1.1±0.05
(0.051±0.002)
1.9±0.05
（0.079±0.002）
4.0±0.1
(0.016max)
0.9max
（0.043±0.002）
1.55±0.2
（0.075±0.002）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.035max）
0.9max
（0.061±0.008）
（0.091±0.008）
（0.157±0.004）
（0.035max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
●Embossed Tape (8mm wide)
φ1.5＋0.1/－0
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.05
F
(0.079±0.002)
Chip cavity
Insertion Pitch
Ｆ
Tape Thickness
Thickness
mm（inch）
Type
Ａ
Ｂ
K
T
1.5±0.2
2.3±0.2
4.0±0.1
2.0
（0.079）
2.0
0.3
CK2125（0805）
CKS2125（0805）
CKP2012（0805）
CKP2016（0806）
1.25（0.049）
1.25（0.049）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
1.1 （0.043）
1.25（0.049）
0.85（0.033）
1.0 （0.039）
1.25（0.049）
0.8 （0.031）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
1.0 （0.039）
1.0 （0.039）
（0.059±0.008）
1.5±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.012）
0.3
（0.059±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.079）
1.3
（0.012）
0.3
（0.061±0.008）
1.8±0.1
（0.091±0.008）
2.2±0.1
（0.157±0.004）
4.0±0.1
（0.051）
1.3
（0.012）
0.25
（0.071±0.004）
（0.087±0.004）
（0.157±0.004）
（0.051）
1.4
（0.01）
（0.055）
1.4
（0.055）
1.7
2.3±0.1
2.8±0.1
4.0±0.1
0.3
CKP2520（1008）
（0.091±0.004）
（0.110±0.004）
（0.157±0.004）
（0.012）
（0.067）
1.7
（0.067）
2.0
1.5±0.2
2.3±0.2
4.0±0.1
0.3
LK2125（0805）
HK2125（0805）
（0.059±0.008）
（0.091±0.008）
（0.157±0.004）
（0.079）
1.5
（0.012）
（0.059）
2.0
1.5±0.2
2.3±0.2
4.0±0.1
0.3
（0.059±0.008）
（0.091±0.008）
（0.157±0.004）
（0.012）
（0.079）
2.0
1.5±0.2
（0.059±0.008）
1.9±0.1
2.3±0.2
（0.091±0.008）
3.5±0.1
4.0±0.1
（0.157±0.004）
4.0±0.1
0.3
（0.012）
0.3
BK2125（0805）
（0.079）
1.4
BK3216（1206）
（0.075±0.004）
0.75±0.05
（0.138±0.004）
0.95±0.05
（0.157±0.004）
2.0±0.05
（0.055）
0.55
（0.012）
0.3
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCKK1608（0603）
MCKK2012（0805）
（0.030±0.002）
1.15±0.05
（0.037±0.002）
1.40±0.05
（0.079±0.002）
4.0±0.1
（0.022）
0.65
（0.012）
0.3
（0.045±0.002）
1.1±0.1
（0.055±0.002）
2.3±0.1
（0.157±0.004）
4.0±0.1
（0.026）
0.85
（0.012）
0.3
（0.043±0.004）
1.1±0.1
（0.091±0.004）
1.95±0.1
（0.157±0.004）
4.0±0.1
（0.033）
1.4
（0.012）
0.25
（0.043±0.004）
1.55±0.2
（±0.004）
（0.157±0.004）
4.0±0.1
（0.055）
1.35
（0.01）
0.25
2.3±0.2
（0.061±0.008）
（0.091±0.008）
（0.157±0.004）
（0.053）
（0.010）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
④LEADER AND BLANK PORTION
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
⑤Reel Size
t
E
C
B
A
R
D
W
A
B
C
φ13.0±0.2
D
E
R
φ178±2.0
φ50 or more
φ21.0±0.8
2.0±0.5
1.0
t
W
4mm width tape
8mm width tape
1.5max.
2.5max.
5±1.0
10±1.5
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E07R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
■RELIABILITY DATA
1. Operating Temperature Range
BK series
BKP series
LK series
HK series
－55～＋125℃
－55～＋125℃ （Including self-generated heat）
－40～＋85℃
Specified Value
－55～＋125℃
2. Storage Temperature Range
BK series
－55～＋125℃
－55～＋125℃
－40～＋85℃
－55～＋125℃
BKP series
Specified Value
LK series
HK series
3. Rated Current
BK series
The temperature of the element is increased within 20℃.
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is
increased within 20℃
BKP series
Specified Value
LK series
HK series
4. Impedance
BK series
Refer to each specification.
BKP series
Specified Value
LK series
－
HK series
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
Test Methods and
Remarks
: 4291A（or its equivalent）
: 16192A（or its equivalent）, HW:16193A（or its equivalent）
5. Inductance
BK series
－
BKP series
Specified Value
LK series
Refer to each specification.
HK series
LK Series
Measuring frequency
Measuring equipment /jig
Measuring current
HK Series
: 10～25MHz
: 4291A＋16193A（or its equivalent）
: 1mA rms
Test Methods and
Remarks
Measuring frequency
Measuring equipment /jig
: 100MHz
: 4291A＋16193A（or its equivalent）
6. Q
BK series
－
BKP series
Specified Value
LK series
Refer to each specification.
HK series
LK Series
Measuring frequency
Measuring equipment /jig
Measuring current
HK Series
: Refer to each specification.
: 4291A＋16193A（or its equivalent）
: 1mA rms
Test Methods and
Remarks
Measuring frequency
: 100MHz
Measuring equipment /jig : 4291A＋16193A（or its equivalent）
7. DC Resistance
Specified Value
BK series
BKP series
Refer to each specification.
LK series
HK series
Test Methods and
Remarks
Measuring equipment：VOAC-7412, VOAC-7512, VOAC-7521（made by Iwasaki Tsushinki）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
8. Self Resonance Frequency（SRF）
BK series
－
BKP series
Specified Value
LK series
Refer to each specification.
HK series
LK Series
Measuring equipment
: 4195A（or its equivalent）
Test Methods and
Remarks
Measuring jig
HK Series :
: 41951＋16092A（or its equivalent）
Measuring equipment
: 8719C（or its equivalent）
9. Temperature Characteristic
BK series
BKP series
Specified Value
－
LK series
HK series
Inductance change：Within ±10％
Test Methods and
Remarks
Temperature range
Reference temperature
: －30～＋85℃
: ＋20℃
10. Resistance to Flexure of Substrate
BK series
BKP series
Specified Value
No mechanical damage.
LK series
HK series
Warp
: 2mm
Testing board
Thickness
20
: glass epoxy-resin substrate
: 0.8mm
Test Methods and
Remarks
R-230
Board
Warp
Deviation±1
45
45
（Unit：mm）
11. Solderability
Specified Value
BK series
BKP series
LK series
HK series
At least 90％ of terminal electrode is covered by new solder.
Solder temperature
Solder temperature
Duration
：230±5℃ (JIS Z 3282 H60A or H63A)
：245±3℃ (Sn/3.0Ag/0.5Cu)
：4±1 sec.
Test Methods and
Remarks
12. Resistance to Soldering
BK series
Appearance：No significant abnormality
Impedance change：Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±15％
Appearance：No significant abnormality
Inductance change： Within ±5％
BKP series
Specified Value
LK series
HK series
Solder temperature
Duration
：260±5℃
：10±0.5 sec.
：150 to 180℃
：3 min.
Test Methods and Preheating temperature
Remarks
Preheating time
Flux
：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
13. Thermal Shock
Specified Value
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKP series
Appearance：No significant abnormality
LK series
HK series
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
BK、BKP、HK Series
Conditions for 1 cycle
Step
temperature（℃）
-40℃ ＋0/－3
time（min.）
30±3
2～3
1
2
Room temperature
+125℃ ＋3/－0
Room temperature
3
30±3
2～3
4
Number of cycles：1000
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
Test Methods and
Remarks
LK Series
Conditions for 1 cycle
Step
temperature（℃）
-40℃ ＋0/－3
time（min.）
30±3
2～3
1
2
Room temperature
+85℃ ＋3/－0
3
30±3
2～3
4
Room temperature
Number of cycles：1000
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
14. Damp Heat（ Steady state）
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKP series
Appearance：No significant abnormality
Specified Value
LK series
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
HK series
Inductance change： Within ±10％ Q change： Within ±20％
Temperature ：85±2℃
Test Methods and
Remarks
Humidity
Duration
Recovery
：80 to 85％RH
：1000＋24/－0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
15. Loading under Damp Heat
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKP series
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
：85±2℃
Specified Value
LK series
HK series
Temperature
Humidity
：80 to 85％RH
Test Methods and
Remarks
Applied current
Duration
：Rated current
：1000＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
16. Loading at High Temperature
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKP series
Appearance：No significant abnormality
Specified Value
LK series
HK series
Inductance change： Within ±10％ Q change： Within ±30％
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
Temperature : Maximum operating Temperature
Applied current ：Rated current
Test Methods and
Remarks
Duration
：1000＋24/－0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_reli_e-E07R01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
Precautions
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
Precautions
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
Chip inductor
Solder-resist
Chip inductor
C
W
B
A
B
L
Recommended land dimensions for wave-soldering （Unit：mm）
Type
1608
1.6
2125
2.0
L
Size
W
0.8
1.25
A
B
C
0.8～1.0
0.5～0.8
0.6～0.8
1.0～1.4
0.8～1.5
0.9～1.2
Technical
considerations
Recommended land dimensions for reflow-soldering （Unit：mm）
Type
1005
1.0
1608
2.0
2125
1.6
L
Size
W
0.5
1.25
0.8
A
B
C
0.45～0.55
0.40～0.50
0.45～0.55
0.8～1.0
0.6～0.8
0.6～0.8
0.8～1.2
0.8～1.2
0.9～1.6
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing
land-patterns.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
（2） Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
3. Considerations for automatic placement
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
Precautions
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method
chipping
or cracking
Single-sided mounting
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Technical
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
considerations
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
［Recommended conditions］
Amount of adhesives
a
After inductors are bonded
a
Figure
0805 case sizes as examples
a
b
c
0.3mm min
100～120μm
b
Area with no adhesive
c
c
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
［Reflow soldering］
【Recommended conditions for eutectic soldering】
300
【Recommended condition for Pb-free soldering】
300
Peak
Preheating
230℃
260℃ Max.
Within 10sec.
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
200
Slow
Slow cooling
cooling
100
Heating above
230℃
Preheating150℃
60sec. Min.
40sec. Max.
0
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
1/2T～1/3T
Inductor
Solder
T
Technical
PC board
considerations
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic soldering】
300
【Recommended condition for Pb-free soldering】
300
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
Preheating
120sec. Min.
120sec. Min.
200
200
100
0
Slow
cooling
Slow cooling
Preheating
150℃
100
0
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic soldering】
400
【Recommended condition for Pb-free soldering】
400
Peak
230～280℃
Within 3sec.
350℃ Max.
Within 3sec.
300
300
⊿T
Slow cooling
200
200
Slow cooling
Preheating
150℃ Min.
100
100
Preheating
60sec. Min.
0
60sec. Min.
0
（※⊿ＴT190℃）
※It is recommended to use 20W soldering iron and the tip is 1φor less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
Technical
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
considerations
Ultrasonic output
Below 20W/ℓ
Below 40kHz
5 min. or less
Ultrasonic frequency
Ultrasonic washing period
6. Post cleaning processes
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
Precautions
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended. When inductors are coated/molded with resin, please check
effects on the inductors by analyzing them in actual applications prior to use.
7. Handling
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
Precautions
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Precautions
Ambient temperature: Below 30℃
Humidity: Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time
passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.
◆Storage
Technical
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_i_mlci_prec_e-E06R01
for High Quality Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE)
REFLOW
■PART NUMBER
*Operating Temp. : -40～125℃（Including self-generated heat）
F
B
△
M
J
3
2
1
6
H
S
8
0
0
－
⑦
T
V
△＝Blank space
①
②
③
④
⑤
⑥
⑧
⑨
①Series name
⑤Material
Code
HS
Code
FB
Series name
Ferrite bead
Material
Refer to impedance curves
for material differences
HM
②Shape
Code
M
HL
Shape
Rectangular chip
⑥Nominal impedance
Code
（example）
330
Nominal impedance［Ω］
③Characteristics
Code
Characteristics
Standard
33
J
221
220
H
High Impedance type
102
1000
④Dimensions（L×W）
Code
⑦Impedance tolerance
Dimensions
（L×W）［mm］
1.6×0.8
Code
－
Impedance tolerance
±25％
Type（inch）
1608
2125
2012
2016
3216
3225
4516
4525
1608（0603）
2125（0805）
2012（0805）
2016（0806）
3216（1206）
3225（1210）
4516（1806）
4525（1810）
N
±30％
2.0×1.25
⑧Packaging
2.0×1.6
3.2×1.6
3.2×2.5
4.5×1.6
4.5×2.5
Code
T
Packaging
Taping
⑨Internal code
Code
V
Internal code
Bead Inductor for Automotive
W
Bead Inductor for Telecommunications infrastructure
and Industrial equipment / Medical devices
8
■FEATURES
●HS：For broadband applications ●HM：For upper MHz range applications ●HL：For GHz range applications
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Type
A
1.0
1.4
1.4
1.75
1.0
1.4
1.4
1.4
1.4
1.75
1.75
B
C
1.0
1.65
2.0
2.0
1.0
1.65
2.0
2.0
2.9
2.0
2.9
Surface Mounting
W
FB MJ1608
FB MJ2125
FB MJ3216
FB MJ4516
FB MH1608
FB MH2012
FB MH2016
FB MH3216
FB MH3225
FB MH4516
FB MH4525
1.0
1.2
2.2
3.5
1.0
1.2
1.2
2.2
2.2
3.5
3.5
・Mounting and soldering conditions should be
checked beforehand.
L
T
C
e
A
B
A
INDL
Unit：mm
Standard quantity [pcs]
Paper tape Embossed tape
Type
L
W
T
e
FB MJ1608
（0603）
FB MJ2125
（0805）
FB MJ3216
（1206）
FB MJ4516
（1806）
FB MH1608
（0603）
FB MH2012
（0805）
FB MH2016
（0806）
FB MH3216
（1206）
1.6±0.2
（0.063±0.008）
2.0±0.2
（0.079±0.008）
3.2±0.3
（0.126±0.012）
4.5±0.3
（0.177±0.012）
1.6±0.1
（0.063±0.004）
2.0±0.2
（0.079±0.008）
2.0±0.2
（0.079±0.008）
3.2±0.3
（0.126±0.012）
3.2±0.3
0.8±0.2
（0.031±0.008）
1.25±0.2
（0.049±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
0.8±0.1
（0.031±0.004）
1.25±0.2
（0.049±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
2.5±0.3
0.8±0.2
（0.031±0.008）
0.85±0.2
（0.033±0.008）
1.1±0.2
（0.043±0.008）
1.1±0.2
（0.043±0.008）
0.8±0.1
（0.031±0.004）
0.85±0.2
（0.033±0.008）
1.6±0.2
（0.063±0.008）
1.6±0.2
（0.063±0.008）
2.5±0.3
0.3±0.2
（0.012±0.008）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.3±0.15
（0.012±0.006）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.5±0.3
4000
4000
－
－
－
2000
2000
－
－
4000
4000
－
－
2000
2000
1000
2000
－
FB MH3225
（1210）
FB MH4516
（1806）
FB MH4525
（1810）
－
（0.126±0.012）
4.5±0.3
（0.177±0.012）
4.5±0.4
（0.177±0.016）
（0.098±0.012）
1.6±0.2
（0.063±0.008）
2.5±0.3
（0.098±0.012）
（0.098±0.012）
1.6±0.2
（0.063±0.008）
2.5±0.3
（0.098±0.012）
（0.020±0.012）
0.5±0.3
（0.020±0.012）
0.9±0.6
（0.035±0.024）
－
－
1000
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
150
for High Quality Equipment
■PART NUMBER
・ All the Chip Bead Inductors for Power Lines of the catalog lineup are RoHS compliant.
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ The products are for Telecommunications infrastructure and Industrial equipment and for Medical devices.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications, etc.,
and please review and approve the product specifications before ordering.
Please be sure to contact us for further information in advance when the products are used for automotive electronic equipment.
Standard type
●FB MJ2125
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Part number
Impedance tolerance
Note
Note
Note
25
42
21
33
8
±30％
±25％
±30％
±25％
±30％
100
100
100
100
100
FB MJ2125HS250NT8
FB MJ2125HS420-T8
FB MJ2125HM210NT8
FB MJ2125HM330-T8
FB MJ2125HL8R0NT8
0.004
0.008
0.004
0.008
0.008
6.0
4.0
6.0
4.0
4.0
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
●FB MJ3216
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
48
80
38
60
16
±30％
±25％
±30％
±25％
±30％
100
100
100
100
100
FB MJ3216HS480NT8
FB MJ3216HS800-T8
FB MJ3216HM380NT8
FB MJ3216HM600-T8
FB MJ3216HL160NT8
0.005
0.010
0.005
0.010
0.012
6.0
4.0
6.0
4.0
4.0
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
●FB MJ4516
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
72
110
56
±30％
±25％
±30％
±25％
±30％
100
100
100
100
100
FB MJ4516HS720NT8
FB MJ4516HS111-T8
FB MJ4516HM560NT8
FB MJ4516HM900-T8
FB MJ4516HL230NT8
0.007
0.014
0.007
0.014
0.014
6.0
4.0
6.0
4.0
3.5
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
1.1 ±0.2
90
23
High impedance type（ＧＨz Band）
●FB MH1608
Nominal impedance
Measuring frequency 100［MHz］
Nominal impedance
Measuring frequency 1［GHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Part number
Note
（Ω）
47
（Ω）
75
tolerance
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
tolerance
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
±40％
FB MH1608HM470-T8
FB MH1608HM600-T8
FB MH1608HM101-T8
FB MH1608HM151-T8
FB MH1608HM221-T8
FB MH1608HM331-T8
FB MH1608HM471-T8
FB MH1608HM601-T8
FB MH1608HM102-T8
FB MH1608HL300-T8
FB MH1608HL600-T8
FB MH1608HL121-T8
FB MH1608HL221-T8
FB MH1608HL331-T8
FB MH1608HL471-T8
FB MH1608HL601-T8
0.020
0.025
0.035
0.050
0.070
0.130
0.150
0.170
0.350
0.028
0.045
0.130
0.170
0.210
0.350
0.450
3.5
3.0
2.5
2.1
1.8
1.2
1.0
0.9
0.6
2.6
2.1
1.2
0.9
0.8
0.6
0.5
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
0.8 ±0.1
60
100
170
270
370
520
750
900
1200
120
220
540
950
1200
1500
1800
100
150
220
330
470
600
1000
30
60
120
220
330
470
600
※）The rated current is the value of current at which the temperature of the element is increased by 40 deg.
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
151
for High Quality Equipment
■PART NUMBER
High impedance type
●FB MH2012
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Part number
Impedance tolerance
Note
80
±25％
±25％
±25％
±25％
100
100
100
100
FB MH2012HM800-T8
FB MH2012HM121-T8
FB MH2012HM221-T8
FB MH2012HM331-T8
0.025
0.032
0.060
0.080
2.7
2.5
2.0
1.8
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
120
220
330
●FB MH2016
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
Note
Note
Note
120
250
±30％
±30％
100
100
FB MH2016HM121NT8
FB MH2016HM251NT8
0.015
0.050
4.5
2.0
1.6 ±0.2
1.6 ±0.2
●FB MH3216
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
220
500
±30％
±30％
100
100
FB MH3216HM221NT8
FB MH3216HM501NT8
0.020
0.070
4.0
2.0
1.6 ±0.2
1.6 ±0.2
●FB MH3225
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
600
1000
2000
±30％
±30％
±30％
100
100
100
FB MH3225HM601NT8
FB MH3225HM102NT8
FB MH3225HM202NT8
0.042
0.100
0.130
3.0
2.0
1.2
2.5 ±0.3
2.5 ±0.3
2.5 ±0.3
●FB MH4516
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Part number
Impedance tolerance
±30％
Note
Note
850
100
FB MH4516HM851NT8
0.100
1.5
1.6 ±0.2
●FB MH4525
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
1000
1600
±30％
±30％
100
100
FB MH4525HM102NT8
FB MH4525HM162NT8
0.060
0.130
3.0
2.0
2.5 ±0.3
2.5 ±0.3
●High current type
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
Note
22
28
18
23
±30％
±30％
±30％
±30％
100
100
100
100
FB MJ1608HS220NT8
FB MJ1608HS280NT8
FB MJ1608HM180NT8
FB MJ1608HM230NT8
0.004
0.006
0.004
0.006
7.5
6.0
7.5
6.0
0.8 ±0.2
0.8 ±0.2
0.8 ±0.2
0.8 ±0.2
※）The rated current is the value of current at which the temperature of the element is increased by 40 deg.
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
152
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
Standard type
■FB MJ2125
FB MJ2125HS250NT
FB MJ2125HS420-T
FB MJ2125HM210NT
30
25
20
15
10
5
50
40
30
20
10
0
50
40
Z
Z
Z
30
R
R
R
20
X
X
10
X
0
0
1
1
1
1
1
10
100
1000
10000
10000
10000
10000
1
1
1
1
1
10
100
1000
10000
1
1
1
1
1
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
■FB MJ3216
FB MJ2125HM330-T
FB MJ2125HL8R0NT
FB MJ3216HS480NT
70
60
50
40
30
20
10
0
50
40
30
20
10
0
60
50
40
30
20
10
0
Z
Z
R
Z
R
R
X
X
X
10
100
1000
10
100
1000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MJ3216HS800-T
FB MJ3216HM380NTV
FB MJ3216HM600-TV
100
80
60
40
20
0
80
70
60
50
40
30
20
10
0
120
100
80
60
40
20
0
Z
Z
Z
R
R
R
X
X
X
10
100
1000
10
100
1000
10000
10
100
1000
10000
10000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
■FB MJ4516
FB MJ3216HL160NT
FB MJ4516HS720NTV
FB MJ4516HS111-TV
100
80
60
40
20
0
100
80
60
40
20
0
140
120
100
80
Z
Z
R
Z
R
R
60
X
INDL
40
X
X
20
0
10
100
1000
10
100
1000
10000
10
100
1000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MJ4516HM560NT
FB MJ4516HM900-TV
FB MJ4516HL230NT
120
100
80
60
40
20
0
160
140
120
100
80
140
120
100
80
Z
Z
R
R
Z
R
60
X
60
40
40
X
X
20
20
0
0
10
100
1000
10000
10
100
1000
10000
10
100
1000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
153
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
High impedance type(GHz Band）
■FB MH1608
FB MH1608HM470-T
FB MH1608HM600-T
FB MH1608HM101-TV
80
70
60
50
40
30
20
10
0
120
100
80
60
40
20
0
200
150
Z
Z
Z
R
R
R
100
50
X
X
X
0
1
1
1
1
1
10
100
1000
10000
1
1
1
1
1
10
100
1000
10000
1
1
1
1
1
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MH1608HM151-T
FB MH1608HM221-T
FB MH1608HM331-T
300
250
200
150
100
50
400
350
300
250
200
150
100
50
600
500
400
300
200
100
0
Z
Z
Z
R
R
R
X
X
X
0
0
10
100
1000
10000
10
100
1000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MH1608HM471-T
FB MH1608HM601-TV
FB MH1608HM102-T
800
700
600
500
400
300
200
100
0
1000
800
600
400
200
0
1600
1400
1200
1000
800
600
400
200
0
Z
Z
Z
R
R
R
X
X
X
10
100
1000
10000
10
100
1000
10000
10000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MH1608HL121-T
FB MH1608HL300-T
FB MH1608HL600-TV
200
150
100
50
350
300
250
200
150
100
50
700
600
500
400
300
200
100
0
Z
Z
R
X
Z
R
R
INDL
X
X
0
0
10
100
1000
10000
10
100
1000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MH1608HL221-T
FB MH1608HL331-T
FB MH1608HL471-T
1200
1000
800
600
400
200
0
1600
1400
1200
1000
800
600
400
200
0
2000
1500
1000
500
0
Z
Z
Z
R
R
R
X
X
X
10
100
1000
10000
10
100
1000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
154
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
FB MH1608HL601-TV
2500
2000
1500
1000
500
Z
R
X
0
1
10
100
1000
10000
Frequency[MHz]
High impedance type
■FB MH2012
FB MH2012HM800-TV
FB MH2012HM121-TV
FB MH2012HM221-TV
140
120
100
80
200
150
100
50
400
350
Z
Z
Z
300
R
250
R
200
150
100
50
R
60
40
20
X
X
X
0
1
0
0
10
100
1000
10000
10000
10000
1
1
1
1
10
100
1000
10000
1
1
1
1
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
■FB MH2016
FB MH2012HM331-T
FB MH2016HM121NT
FB MH2016HM251NTV
600
500
400
300
200
100
200
400
350
300
250
200
150
100
50
Z
Z
150
100
50
Z
R
R
R
X
X
X
1000
0
1
0
0
10
100
1000
10
100
Frequency[MHz]
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
■FB MH3216
■FB MH3225
FB MH3216HM221NT
FB MH3216HM501NTV
FB MH3225HM601NT
350
300
250
200
150
100
50
800
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
Z
Z
R
Z
R
R
INDL
X
X
X
1000
0
1
10
100
Frequency[MHz]
10
100
1000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
■FB MH4516
FB MH3225HM102NT
FB MH3225HM202NTV
FB MH4516HM851NT
1200
1000
800
600
400
200
0
2500
2000
1500
1000
500
1400
1200
1000
800
600
400
200
0
Z
R
Z
Z
R
R
X
X
X
0
1
10
100
1000
10000
10
100
1000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
155
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■FB MH4525
■
High current type
FB MH4525HM102NT
FB MH4525HM162NT
FB MJ1608HS220NT
1400
1200
1000
800
600
400
200
0
2000
1500
1000
500
0
30
25
20
15
10
5
R
R
Z
Z
Z
R
X
X
X
0
1
1
10
100
1000
10000
1
10
100
1000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
FB MJ1608HS280NT
FB MJ1608HM180NTW
FB MJ1608HM230NT
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
50
40
30
20
10
Z
Z
Z
R
R
R
X
X
X
0
0
0
1
1
10
100
1000
10000
1
10
100
1000
10000
10
100
1000
10000
Frequency[MHz]
Frequency[MHz]
Frequency[MHz]
■Derating of Rated Current
●FB series M type
ꢀ Derating of current is necessary for FB series M type depending on ambient temperature.
ꢀ Please refer to the chart shown below for appropriate derating of current.
FB series M type
120%
100%
80%
60%
40%
20%
0%
INDL
-40 -20
0
20
40
60
80 100 120 140
Ambient Temperature(℃)
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
156
for High Quality Equipment
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES T TYPE)
REFLOW
AEC-Q200
AEC-Q200 Grade 1 (we conduct the evaluation at the test condition of Grade 1.)
*Operating environment Temp:-40～125℃
■PART NUMBER
*Operating Temp. : -40～150℃（Including self-generated heat）
△＝Blank space
F
B
△
T
H
1
6
0
8
H
E
4
7
0
－
⑦
T
①
②
③
④
⑤
⑥
⑧
①Series name
⑤Material
Code
HE
Code
FB
Series name
Ferrite bead
Material
Refer to impedance curves
for material differences
HL
②Shape
Code
T
Shape
⑥Nominal impedance
Rectangular chip（High-Reliability）
Code
（example）
300
Nominal impedance［Ω］
③Characteristics
30
Code
H
Characteristics
221
220
High Impedance type
102
1000
④Dimensions（L×W）
⑦Impedance tolerance
Dimensions
Type（inch）
Code
－
Impedance tolerance
±25％
Code
1608
（L×W）［mm］
1608（0603）
1.6×0.8
⑧Packaging
Code
T
Packaging
Taping
■FEATURES
●HE：For upper MHz range applications
●HL：For GHz range applications
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
Recommended Land Patterns
Surface Mounting
Type
FB TH1608
A
B
C
W
1.0
1.0
1.0
L
・Mounting and soldering conditions should be
checked beforehand.
Unit：mm
T
e
C
AUTO
INDL
A
B
A
Standard quantity [pcs]
Paper tape Embossed tape
Type
L
W
T
e
FB TH1608
（0603）
1.6±0.15
0.8±0.15
0.8±0.15
（0.031±0.006）
0.4±0.2
4000
－
（0.063±0.006）
（0.031±0.006）
（0.015±0.008）
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
Web_1
for High Quality Equipment
■PART NUMBER
・ All the Chip Bead Inductors for Power Lines of the catalog lineup are RoHS compliant.
Notes)
・ The exchange of individual specifications is necessary depending on your application and/or circuit condition. Please contact TAIYO YUDEN's official sales channel.
・ For Automotive (AEC-Q200 Qualified) products for POWERTRAIN, and SAFETY. Please check ”Automotive Application Guide” for further details before using the products.
AEC-Q200
ꢀꢀ＜ꢀꢀ：AEC-Q200 qualified＞
All the Chip Bead Inductors for Power Lines for Automotive products are tested based on the test conditions and methods defined in AEC-Q200 by family item.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications and AEC-Q200 test results, etc.,
and please review and approve the product specifications before ordering.
・ The products are for Telecommunications infrastructure and Industrial equipment and for Medical devices.
Please consult with TAIYO YUDEN's official sales channel for the details of the product specifications, etc.,
and please review and approve the product specifications before ordering.
Please be sure to contact us for further information in advance when the products are used for automotive electronic equipment.
●FB TH1608HE
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Part number
Impedance tolerance
Note
47
60
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
FB TH1608HE470-T
FB TH1608HE600-T
FB TH1608HE101-T
FB TH1608HE151-T
FB TH1608HE221-T
FB TH1608HE331-T
FB TH1608HE471-T
FB TH1608HE601-T
FB TH1608HE102-T
0.020
0.025
0.035
0.050
0.070
0.130
0.150
0.170
0.350
2.5
2.3
1.9
1.5
1.3
0.9
0.7
0.6
0.5
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
100
150
220
330
470
600
1000
●FB TH1608HL
Part number
Nominal impedance
（Ω）
Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Impedance tolerance
Note
30
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
FB TH1608HL300-T
FB TH1608HL600-T
FB TH1608HL121-T
FB TH1608HL221-T
FB TH1608HL331-T
FB TH1608HL471-T
FB TH1608HL601-T
0.028
0.045
0.130
0.170
0.210
0.350
0.450
2.00
1.60
0.95
0.65
0.60
0.50
0.42
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
0.8 ±0.15
60
120
220
330
470
600
※）The rated current is the value of current at which the temperature of the element is increased by 40 deg.
AUTO
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
Web_2
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■FB TH1608HE
■FB TH1608HL
AUTO
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
Web_3
for High Quality Equipment
■ELECTRICAL CHARACTERISTICS
■Derating of Rated Current
●FB series T type
ꢀ Derating of current is necessary for FB series T type depending on ambient temperature.
ꢀ Please refer to the chart shown below for appropriate derating of current.
FB series T type
Rated current at 150℃ is 10mA
125
150
Ambient Temperature (℃)
AUTO
INDL
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
Web_4
CHIP BEAD INDUCTORS FOR POWER LINES (FB SERIES M TYPE / T TYPE)
■PACKAGING
①Minimum Quantity
Standard Quantity［pcs］
Type
Paper Tape
Embossed Tape
1608（0603）
2125（0805）
2012（0805）
2016（0806）
3216（1206）
3225（1210）
4516（1806）
4525（1810）
4532（1812）
4000
4000
4000
－
－
－
－
2000
2000
1000
2000
1000
2000
－
－
－
－
－
②Tape Material
●Card board carrier tape
Top tape
Base tape
Chip Filled
Sprocket hole
Chip cavity
Bottom tape
Chip
●Embossed tape
Top tape
Chip Filled
Sprocket hole
Chip cavity
Base tape
Chip
③Taping Dimensions
●Paper tape (0.315 inches wide)
1.75±0.1
(0.069±0.004）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Sprocket hole
T
A
B
4.0±0.1
(0.157±0.004)
2.0±0.05
F
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_pack_e-E08R01
Chip Cavity
Insertion Pitch
F
Tape Thickness
T
Type
A
B
FB MJ1608
FB MH1608
FB TH1608
（0603）
1.0±0.2
1.8±0.2
4.0±0.2
1.1max
（0.039±0.008）
（0.071±0.008）
（0.157±0.008）
（0.043max）
FB MJ2125
FB MH2012
（0805）
1.5±0.2
2.3±0.2
4.0±0.2
1.1max
（0.059±0.008）
（0.091±0.008）
（0.157±0.008）
（0.043max）
Unit : mm（inch）
●Embossed tape (0.315 inches wide)
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
1.75±0.1
(0.069±0.004）
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.05
F
(0.079±0.002)
Chip Cavity
Insertion Pitch
F
Tape Thickness
Type
A
B
K
T
FB MH2016
（0806）
1.8±0.2
2.2±0.2
（0.087±0.008）
3.5±0.2
4.0±0.2
2.6max
0.6max
（0.071±0.008）
1.9±0.2
（0.157±0.008）
4.0±0.2
（0.102max）
1.5max
（0.024max）
0.3max
FB MJ3216
（1206）
（0.075±0.008）
1.9±0.2
（0.138±0.008）
3.5±0.2
（0.157±0.008）
4.0±0.2
（0.059max）
2.6max
（0.012max）
0.6max
FB MH3216
（1206）
（0.075±0.008）
2.8±0.2
（0.138±0.008）
3.5±0.2
（0.157±0.008）
4.0±0.2
（0.102max）
4.0max
（0.024max）
0.6max
FB MH3225
（1210）
（0.110±0.008）
（0.138±0.008）
（0.157±0.008）
（0.157max）
（0.024max）
Unit : mm（inch）
●Embossed tape (0.472 inches wide)
φ1.5＋0.1/－0
1.75±0.1
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
T
A
B
K
F
4.0±0.1
(0.157±0.004)
2.0±0.05
(0.079±0.002)
Chip Cavity
Insertion Pitch
F
Tape Thickness
Type
A
B
K
T
FB MJ4516
（1806）
1.9±0.2
4.9±0.2
4.0±0.2
1.5max
0.3max
（0.075±0.008）
1.9±0.2
（0.193±0.008）
4.9±0.2
（0.157±0.008）
4.0±0.2
（0.059max）
2.6max
（0.012max）
0.6max
FB MH4516
（1806）
（0.075±0.008）
2.9±0.2
（0.193±0.008）
4.9±0.2
（0.157±0.008）
4.0±0.2
（0.102max）
4.0max
（0.024max）
0.6max
FB MH4525
（1810）
（0.114±0.008）
3.6±0.2
（0.193±0.008）
4.9±0.2
（0.157±0.008）
8.0±0.2
（0.157max）
4.0max
（0.024max）
0.6max
FB MH4532
（1812）
（0.142±0.008）
（0.193±0.008）
（0.315±0.008）
（0.157max）
（0.024max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_pack_e-E08R01
④Leader and Blank portion
⑤Reel size
2.0±0.5
（0.079±0.020）
t
φ13.0±0.5
（φ0.512±0.020）
φD
φd
φ21.0±0.8
（φ0.827±0.031）
R1.0
W
Type
φD
φd
W
t
FB MJ1608
FB MJ2125
FB MJ3216
10.0±1.5
（0.394±0.059）
14.0±1.5
FB MJ4516
（0.551±0.059）
FB MH1608
FB MH2012
FB MH2016
FB MH3216
FB MH3225
FB MH4516
FB MH4525
180＋0/－3
60＋1/－0
2.5max
（7.09＋0/－0.118 ）
（2.36＋0.039/－0 ）
(0.098max)
10.0±1.5
（0.394±0.059）
14.0±1.5
（0.551±0.059）
14.0±2.0
330±2.0
（12.99±0.080）
180＋0/－3
100±1.0
（3.94±0.039）
60＋1/－0
3.0max
(1.181max)
2.5max
FB MH4532
FB TH1608
（0.551±0.080）
10.0±1.5
（7.09＋0/－0.118 ）
（2.36＋0.039/－0 ）
（0.394±0.059）
(0.098max)
Unit : mm（inch）
⑥Top tape strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipbeads_pack_e-E08R01
CHIP BEAD INDUCTORS FOR POWER LINE (FB SERIES M TYPE / T TYPE)
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
－40℃～＋125℃ （Including self-generated heat）
Including self-generated heat
Test Methods and
Remarks
2. Storage Temperature Range
Specified Value
－40℃～＋85℃
Test Methods and
Remarks
*Note: －5 to ＋40℃ in taped packaging
3. Impedance
Specified Value
Within the specified tolerance
Test Methods and Measuring equipment
: Impedance analyzer (HP4291A) or its equivalent
: 100±1 MHz
Remarks
Measuring frequency
4. DC Resistance
Specified Value
Within the specified range
Test Methods and Four-terminal method
Remarks
Measuring equipment : Milliohm High-Tester 3226 (Hioki Denki) or its equivalent
5. Rated Current
Specified Value
Within the specified range
6. Vibration
Appearance
: No significant abnormality
Specified Value
Impedance change
: Within ±30% of the initial value
According to JIS C 0040.
Vibration type
: A
Test Methods and Time
: 2 hrs each in X,Y, and Z directions Total: 6 hrs
Remarks
Frequency range
: 10 to 55 to 10Hz (/min.)
Amplitude
: 1.5 mm (shall not exceed acceleration 196m/s2)
: Soldering onto PC board
Mounting method
7. Solderability
Specified Value
90% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Solder temperature
Test Methods and Immersion time
: 230±5℃
: 4±1 sec.
Remarks
Preconditioning
: Immersion into flux.
: 25mm/sec.
Immersion and Removal speed
8. Resistance to Soldering Heat
Appearance
: No significant abnormality
Specified Value
Impedance change
Preheating
Resistance to Soldering Heat
Test Methods and Duration
: Within ±30% of the initial value
: 150℃ for 3 min.
: 260±5℃
: 10±0.5 sec.
Remarks
Preconditioning
: Immersion into flux.
Immersion and Removal speed
Recovery
: 25mm/sec.
: 2 to 3 hrs of recovery under the standard condition after the test.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_reli_e-E08R01
9. Thermal Shock
Specified Value
Appearance
: No significant abnormality
Impedance change
: Within＋50/－10% of the initial value
According to JIS C 0025.
Conditions for 1 cycle
Step
Temperature (℃)
－40±3℃
Duration (min.)
1
2
3
4
30±3
Within 3
30±3
Room Temperature
85±2℃
Test Methods and
Remarks
Room Temperature
Within 3
Number of cycles
Mounting method
Recovery
: 100
: Soldering onto PC board
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
10. Resistance to Humidity (steady state)
Appearances
Specified Value
: No significant abnormality
Impedance change
: Within ±30% of the initial value
Temperature
: 40±2℃
Humidity
Test Methods and
Duration
: 90 to 95% RH
: 500＋24/－0
Remarks
Mounting method
: Soldering onto PC board
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
11. Loading under Damp Heat
Appearance
Specified Value
No ignificant abnormality
Impedance change
Within ±30% of the initial value
Temperature
Humidity
: 40±2℃
: 90 to 95%RH
Test Methods and Applied current
: Rated current
Remarks
Duration
: 500＋24/－0 hrs
Mounting method
Recovery
: Soldering onto PC board
: 2 to 3hrs of recovery under the standard condition after the removal from test chamber.
12. High Temperature Loading Test
Appearance
Specified Value
: No significant abnormality
Impedance change
: Within ±30% of the initial value
Temperature
: 85±2℃
Duration
Test Methods and
Applied current
: 500＋24/－0 hrs
: Rated current
Remarks
Mounting method
: Soldering onto PC board
Recovery
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
13. Bending Strength
Specified Value
Appearance
Warp
: No mechanical damage.
: 2mm
Testing board : Glass epoxy-resin substrate
Thickness : 0.8mm
Test Methods and
Remarks
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_reli_e-E08R01
14. Adhesion of Electrode
Specified Value
No separation or indication of separation of electrode.
Applied force
Duration
: 5N
: 10 sec.
Test Methods and
Remarks
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_reli_e-E08R01
CHIP BEAD INDUCTORS FOR POWER LINE （FB SERIES M TYPE / T TYPE）
■PRECAUTIONS
1. Circuit Design
◆Operating environment
1. The products listed in this catalogue are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric
appliances, office equipment, information and communication equipment), general medical equipment, industrial equipment, and automotive
interior applications, etc.
Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause
loss of human life or bodily injury (e.g., specially controlled medical equipment, transportation equipment including, without limitation,
Precautions
automotive powertrain control system, train control system, and ship control system, traffic signal equipment).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment,
aviation equipment, nuclear control equipment, undersea equipment, military equipment, etc.).
◆Rated current
1. Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in
case of the generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating
conditions.
2. PCB Design
Precautions
◆Land pattern design
1. Please refer to a recommended land pattern.
3. Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
◆Adjustment of mounting machine
considerations
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
◆Wave soldering
1. Please refer to the specifications in the catalog for a wave soldering.
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
◆Lead free soldering
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering
heat, etc. sufficiently.
Precautions
◆Preheating when soldering
Heating : The temperature difference between soldering and remaining heat should not be greater than 150℃.
Cooling : The temperature difference between the components and cleaning process should not be greater than 100℃.
◆Recommended conditions for using a soldering iron
Put the soldering iron on the land-pattern.
Soldering iron's temperature - Below 350℃
Duration - 3 seconds or less
The soldering iron should not directly touch the inductor.
◆Wave, Reflow, Lead free soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
【Recommended reflow condition】
Technical
considerations
◆Preheating when soldering
1. There is a case that products get damaged by a heat shock.
◆Recommended conditions for using a soldering iron
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently
degrade the reliability of the products.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_prec_e-E08R01
5. Handling
◆Handling
1. Keep the inductors away from all magnets and magnetic objects.
◆Setting PC boards
1. When setting a chip mounted base board, please make sure that there is no residual stress to the chip by distortion in the board or at
screw part.
Precautions
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the
board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the inductors any excessive mechanical shocks.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Setting PC boards
Technical
1. There is a case that a characteristic varies with residual stress.
◆Breakaway PC boards (splitting along perforations)
1. Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
considerations
1. There is a case to be damaged by a mechanical shock.
6. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the
storage area should be controlled.
・Recommended conditions
Precautions
Ambient temperature -5～40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may
decrease as time passes.
For this reason, inductors should be used within 6 months from the time of delivery.
◆Storage
Technical
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/packaging materials may take place.
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
hq_chipbeads_prec_e-E08R01
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